Coraynic Technology Limited
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AlN’s thermal conductivity is 10 times more than Al2O3’s, and AlN can match with silicon in CTE. Therefore, AlN multilayer ceramic substrates are most suitable for large power semiconductor chip packaging and HDP, especially for MCM. We can stably provide AlN multilayer ceramic substrates with thermal conductivity from 150W/mK to 190W/mK.
The main technical specification are as follows:
1) Thermal conductivity: ≥170W / mK;
2) Resistivity: ≥1014Ω · cm;
3) Dielectric constant: 8.8@1MHz;
4) Dielectric loss: 0.0005@1MHz;
5) Thermal expansion coefficient: 4.2 ~ 4.6 * 10-6 / ℃;
6) Square resistance of inner wire: 18mΩ / □;
7) Maximum product size: 175mm x 175mm;
8) Finest line and line spacing: 200µm;
9) Minimum aperture: 200µm;
AlN ceramic substrate